Method of manufacturing a semiconductor device and semiconductor device

ABSTRACT

A method of manufacturing a semiconductor device has forming, in a dielectric film, a first opening and a second opening located in the first opening, forming a first metal film containing a first metal over a whole surface, etching the first metal film at a bottom of the second opening using a sputtering process and forming a second metal film containing a second metal over the whole surface, and burying a conductive material in the second opening and the first opening.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromthe prior Japanese Patent Application No. 2007-119144, filed on Apr. 27,2007, the entire content of which is incorporated herein by reference.

BACKGROUND

The present invention relates to a method of manufacturing asemiconductor device and a semiconductor device.

In recent years, transistors are becoming increasingly finer and thenumber of transistors embedded in a semiconductor integrated circuit isincreasing. In addition, a wire for connecting transistors is becominglonger and the delay of electrical signals passing through the wire isgrowing.

A multilayer wiring structure interconnecting upper wiring and lowerwiring through a via hole is used. Low-resistance Cu is adopted as ametal wiring material. When forming a Cu wiring, a barrier layer toprevent diffusion of Cu needs to be formed between an interlayerdielectric film and the Cu wiring.

SUMMARY OF THE INVENTION

According to an aspect of the invention, a method of manufacturing asemiconductor device includes forming, in the dielectric film, a firstopening and a second opening located in the first opening, forming afirst metal film containing a first metal over a whole surface, etchingthe first metal film at a bottom of the second opening using asputtering process and forming a second metal film containing a secondmetal over the whole surface, and burying a conductive material in thesecond opening and the first opening.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1E are views showing a process of sputter-etching the bottomof a via hole;

FIG. 2 is a section photograph of a device in which a wiring layer isformed;

FIG. 3 is a graph showing XRD results of a tantalum layer;

FIGS. 4A and 4B are sectional views showing a process of manufacturing asemiconductor device using a Ti film and a Ta film as barrier metals;

FIGS. 5A to 5C are views of a process of manufacturing a semiconductordevice according to an embodiment of the present invention;

FIGS. 6A to 6E are views of a process of manufacturing a semiconductordevice according to another embodiment of the present invention;

FIGS. 7A and 7B are graphs showing resistance values of Cu wirings;

FIGS. 8A and 8B are STEM photographs of sections of the semiconductordevices of the present invention;

FIGS. 9A and 9B are phase diagrams of Cu and Ti, and Cu and Tarespectively;

FIG. 10 is a graph showing an aspect ratio of a via hole and thicknessof Cu layer;

FIGS. 11A and 11B are views of samples for EDX analysis;

FIGS. 12A and 12B are observation photographs by STEM of a via holesection on which FIB processing is performed; and

FIGS. 13A to 13C are EDX analysis results.

PREFERRED EMBODIMENT

Embodiments of the present invention will be described in detail belowwith reference to the drawings. However, the technical scope of thepresent invention is not limited by these embodiments.

The embodiment uses a method of sputter-etching a barrier metal formedat the bottom of a via hole. First, sputter-etching of the bottom of thevia hole will be described. In FIG. 1A, a tantalum film 101 c is formedover an inner wall of a trench formed in a dielectric layer 101 a. A Culayer 101 d is formed over the tantalum film 101 c and the chemicalmechanical polishing (CMP) method is used to form a wiring layer 101.

An interlayer dielectric film 102 is formed over the wiring layer 101via a Cu barrier dielectric film 102 a.

A hard mask film 102 b is used to form a via hole 103 and a wiringgroove 104 in the interlayer dielectric film 102.

A Ta film 105 is formed on the inner walls of the via hole 103 and thewiring groove 104 and over an upper surface of the hard mask film 102 bas a barrier layer.

In FIG. 1B, in a Ta sputtering step, Ta is deposited over the wholesurface and also Ta deposited at the bottom of the via hole 103 isetched by, for example, Ta ions 106 or argon ions. Ta ions sputteredfrom the bottom of the via hole 103 by etching adhere to sidewalls ofthe via hole 103 and the wiring groove 104. In the Ta sputtering step, aportion of the Cu layer 101 d at the bottom of the via hole 103 mayfurther be etched. The sputtering step is performed by setting thetarget power supply from 1 kW to 5 kW, the substrate bias from 200 W to400 W, and a deposition rate Vd and an etching rate Ve of Ta over thehard mask film 102 b so that the ratio (Vd/Ve) is Vd/Ve≦1, for example,Vd to 0.7 nm/sec and Ve to 0.9 nm/sec. Under these conditions, the Tafilm 105 is intensively etched at the bottom of the via hole 103. The Tafilm 105 formed in the via hole 103 is removed in order to suppresssheet resistance.

A portion of the Ta film 105 at the bottom of the via hole 103 may beleft, instead of being completely removed by etching in the sputteringstep. In this case, the thickness of the Ta film 105 at the bottom ofthe via hole 103 is thinner than that of the Ta film 105 at the bottomof the wiring groove 104. Here, Ar ions are taken as an example to beused for etching, but any gas that does not react with Ta, for example,He or Xe may also be used.

In FIG. 1C, after removing the Ta film 105 at the bottom of the via hole103, a seed Cu film 107 a is formed by using the sputtering process.

In FIG. 1D, a Cu layer 107 is formed over the seed Cu film 107 a byusing the electroplating method to bury the via hole 103 and the wiringgroove 104.

In FIG. 1E, the Cu layer 107 and the Ta film 105 over the hard mask film102 b are removed by using the CMP method.

A semiconductor device formed by the above methods was observed by usingscanning transmission electron microscopy (STEM).

FIG. 2 is an observation photograph by STEM of a section of thesemiconductor device having a Cu multilayer wiring structure. Thediameter of the via hole 103 is 100 nm and the width of the wiringgroove 104 is 100 nm.

Since the Ta film 105 at the bottom of the via hole 103 and the wiringgroove 104 has been etched by using the Ta ions 106, the thickness ofthe Ta film 105 at the bottom of the via hole 103 is thinner than thatof the Ta film 105 formed at the bottom and at the sidewall of thewiring groove 104. The wiring layer 101 below the via hole 103 is alsoetched, generating a dent. When the Ta film 105 deposited at the bottomof the via hole 103 is etched, etched Ta atoms adhere to the sidewall ofthe via hole 103.

The results of performing X-ray diffraction (XRD) will be described.

FIG. 3 is a graph showing results of performing XRD on the tantalumlayer of a semiconductor device formed according to the above methods.

It is evident from FIG. 3 that the Ta film 105 over the interlayerdielectric film 102 shows crystallinity and also the Ta film 105 is an αphase.

FIGS. 4A and 4B describe a process of forming wiring obtained by causinga Ti layer and a Ta layer to laminate in an opening of a via hole and awiring groove formed in a dielectric film and burying Cu thereon.

In FIGS. 4A and 4B, the same reference numerals are attached to the samecomponents as those in FIGS. 1A to 1E.

In FIG. 4A, the wiring layer 101 includes a Ti film 101 e, a Ta film 101c, and a Cu layer 101 d in a wiring groove formed in the dielectriclayer 101 a is formed. Here, the Ti film 101 e improves adhesiveproperties between the Ta film 101 c and the interlayer dielectric film102. Reference numeral 101 b is a hard mask.

The barrier dielectric film 102 a and the interlayer dielectric film 102is formed over the wiring layer 101.

The via hole 103 and the wiring groove 104 are formed in the interlayerdielectric film 102. Reference numeral 102 b is a hard mask film.

A Ti film 108 is formed over the inner walls of the via hole 103 and thewiring groove 104 and over the upper surface of the hard mask film 102b. The long-throw sputtering process maybe used for the formation of theTi film 108 under the conditions of the target power supply of 1 kW to18 kW, the substrate bias of 0 W to 500 W, Vd of 2.0 nm/sec, and Ve of0.3 nm/sec so that the thickness of the Ti film 108 is about 13 nm.

The Ta film 105 is formed over the Ti film 108. The long-throwsputtering process maybe used for the formation of the Ta film 105 underthe conditions of the target power supply of 1 kW to 18 kW, thesubstrate bias of 0 W to 500 W, Vd of 1.4 nm/sec, and Ve of 0.8 nm/secso that the thickness of the Ta film 105 is about 10 nm. The Ta film 105is formed also at the bottom of the via hole 103 and the wiring groove104.

In FIG. 4B, the Cu layer 107 is deposited over the Ta film 105 to burythe via hole 103 and the wiring groove 104.

The Cu layer 107, the Ti film 108, and the Ta film 105 over the hardmask film 102 b are removed by using the CMP method.

FIGS. 5A to 5C are sectional views of a method of manufacturing asemiconductor device in one embodiment of the present invention.

In FIG. 5A, a wiring layer 11 is formed by burying a conductive materialin a dielectric film formed over a semiconductor substrate.

An interlayer dielectric film 12 is formed over the wiring layer 11. Inthe interlayer dielectric film 12, a wiring groove 13 and a via hole 14in the wiring groove 13 reaching the wiring layer 11 are formed.

A Ti film, for example, is formed over the inner walls of the wiringgroove 13 and the via hole 14 and on the surface of the interlayerdielectric film 12 as a first metal film 15.

In FIG. 5B, a Ta film, for example, is formed over the surface of thefirst metal film 15 as a second metal film 16, which is a barrier layer,by using the sputtering process, while etching the first metal film 15at the bottom of the via hole 14. In this step, an alloy layer 16 aincluding a first metal element of the first metal film 15 and a secondmetal element of the second metal film 16. The first metal film 15 atthe bottom of the via hole 14 may partially be removed, instead ofremoving the first metal film 15 completely.

In FIG. 5C, a conductive material 17 a is deposited over the first andsecond metal films 15, 16. The metal films 15, 16 over the conductivematerial 17 a are removed by the CMP method.

An alloy film of the sputtered first metal film 15 and second metal film16 is formed over the sidewall of the via hole 14.

In the above manufacturing method, after forming the first metal film15, the second metal film 16 was formed while etching the first metalfilm 15 at the bottom of the via hole 14. As a different method, afterforming the second metal film 16 over the first metal film 15, the firstmetal film 15 and the second metal film 16 at the bottom of the via hole14 may be etched. Also in this case, an alloy film is similarly formedat the sidewall of the via hole 14.

FIGS. 6A to 6E are sectional views of another method of manufacturing asemiconductor device.

In FIG. 6A, wiring including a Ti film 21 b, a Ta film 21 c, and a Culayer 21 d is formed in a dielectric layer 21 a.

A Cu barrier dielectric film 22 c, an interlayer dielectric film 22 a,an interlayer dielectric film 22 b, and a hard mask film 22 d aresequentially formed over a wiring layer 21.

A wiring groove 23 and a via hole 24 are formed in the interlayerdielectric film 22 a and the interlayer dielectric film 22 b. Theinterlayer dielectric film 22 a and the interlayer dielectric film 22 bmay form different layers or a single layer made of the same material.

A Ti film 25 is formed over the inner wall of the wiring groove 23, overthe inner wall of the via hole 24, and over the upper surface of thehard mask film 22 d. The long-throw sputtering process, for example,maybe used for the formation of the Ti film 25 with a target powersupply of 1 kW to 18 kW, a substrate bias of 0 W to 500 W, Vd of 2.0nm/sec, and Ve of 0.3 nm/sec so that the Ti film 25 with a thickness ofabout 13 nm was formed over the hard mask film 22 d.

In FIG. 6B, a Ta film 26 is formed over the whole surface of the Ti film25. The long-throw sputtering process, for example, maybe used for theformation of the Ta film 26 with a target power supply of 1 kW to 18 kW,a substrate bias of 0 W, Vd of 1.0 nm/sec in a region where a flat part,that is, where the wiring groove 23 was not formed, and Ve of 0 nm/secso that the thickness of the Ta film 26 is about 10 nm.

In FIG. 6C, a sputtering process with a Ta target is used to etch the Tifilm 25 and the Ta film 26 is formed at the bottom of the via hole 24using Ta ions 26 a or Ar ions. Sputtering maybe performed, for example,with a target power supply of 1 kW to 5 kW, a substrate bias of 200 W to400 W, Vd of 0.7 nm/sec in a region where a flat part, that is, wherethe wiring groove 23 was not formed, and Ve of 0.9 nm/sec, that is,Vd/Ve≦1. The sputtering conditions change depending on the aspect ratioof the via hole 24 and other conditions, and the above sputteringconditions may be changed.

Under these conditions, sputter-etching is intensively performed at thebottom of the via hole 24, so that the Ti film 25 and the Ta film 26formed at the bottom of the via hole 24 are etched. The Ta film 26 andthe Ti film 25 sputtered from the bottom of the via hole 24 and the Taions 26 a sputtered from the target are deposited onto the sidewall ofthe via hole 24 as an alloy film 27 of Ti and Ta.

As shown in FIG. 6C, the Ta film 26 is formed over the sidewall and atthe bottom of the wiring groove 23 and over the sidewall of the via hole24. Further, a Ti—Ta film 27 is formed over the Ta film 26 over thesidewall of the via hole 24. Since the Ta film 26 is formed at thebottom and on the sidewall of the wiring groove 23, the Ti film 25 isnot directly in contact with a Cu layer 29 formed later. Thus, the Tielement can be prevented from being diffused into the Cu layer 29 ofmetallic wiring.

A portion of the Ti film 25 formed at the bottom of the via hole 24 maybe left, instead of being completely removed by etching at the bottom ofthe via hole 24. In this case, the thickness of the Ti film 25 at thebottom of the via hole 24 is thinner than that of the Ti film 25 at thebottom of the wiring groove 23.

In FIG. 6D, a seed Cu film 28 is formed over the whole opening of thewiring groove 23 and the via hole 24 by using the sputtering process. Atthis time, the Ti—Ta film 27 is already formed over the sidewall of thevia hole 24 and the Cu element of the seed Cu film 28 and the Ti elementof the Ti—Ta film 27 may react, improving formation coverage of the seedCu film 28.

In FIG. 6E, the Cu layer 29 is deposited using the electroplating methodto bury the via hole 24. Then the wiring groove 23, and the Cu layer 29,the Ta film 26, and the Ti film 25 over the hard mask film 22 d areremoved by using the CMP method.

The Ti—Ta film 27 can be formed over the Ta film 26 at the sidewall ofthe via hole 24, making formation of the seed Cu film 28 in the via hole24 easier. Moreover, since the Ti—Ta film 27 can intensively be formedat the inner wall of the via hole 24, an increase in resistance of theCu layer 29 due to diffusion of Ti into the Cu layer 29 formed insidethe wiring groove 23 can be suppressed.

In the present embodiment, the Ta film 26 is formed over the Ti film 25,for example, up to 10 nm in thickness and then, the bottom of the viahole 24 is etched under the conditions of Vd/Ve≦1 using a Ta target.However, the bottom of the via hole 24 may be etched under theconditions of Vd/Ve≦1 using a Ta target without depositing the Ta film26 onto the Ti film 25. Also in this case, the Ti—Ta film 27 can bedeposited onto the sidewall of the via hole 24. In both the embodiments,after the bottom of the via hole 24 is etched, 3 nm to 7 nm, forexample, 5 mm of the Ta film may be deposited by sputtering. Thisadditional Ta film formation has a thickness about 20% of the thicknessof the Ta film 26 formed at the sidewall and at the bottom of the wiringgroove 23. Since the Ta film additionally deposited onto the sidewall ofthe via hole 24 is thin, an effect of improved Cu coverage by the Ti—Tafilm 27 is not suppressed. The formation process of this additional Tafilm may be applied to the embodiment described in FIGS. 5A to 5C.

FIGS. 7A and 7B are graphs showing resistance values of a device A,which is a semiconductor device formed in the step shown in FIGS. 1A and1B, a device B, which is a semiconductor device formed in the step shownin FIG. 4A, and a device C, which is a semiconductor device formed inthe step shown in FIGS. 5A to 5C.

The horizontal axis in FIGS. 7A and 7B show the value of chainresistance [Ω] and the vertical axis in FIGS. 7A and 7B show thecumulative probability [%] with respect to the resistance value. FIG. 7Ashows a case immediately after the above semiconductor manufacturingstep is completed and FIG. 7B shows a case in which the devices are leftalone for 400 hours to 600 hours in a high-temperature environment of100° C. to 250° C. after the semiconductor manufacturing step iscompleted.

In FIG. 7A, the chain resistance of the device B is higher than that ofthe device A or the device C. On the other hand, FIG. 7A shows that thedevice A and the device C have stable chain resistance.

The chain resistance of the device A in FIG. 7B is higher than the chainresistance of the device A in FIG. 7A. The chain resistance of thedevice C showed lower values.

A semiconductor device 20 formed by a manufacturing method according toone of the above embodiments was observed using STEM.

FIGS. 8A and 8B show observation photographs by STEM of a section of asemiconductor device according to an embodiment. The diameter of the viahole 24 is 100 nm and the width of the wiring groove 23 is about 100 nm.Further, FIG. 8A shows the formed Ti film 25 when the thickness thereofis about 13 nm and FIG. 8B shows the Ti film 25 when the thicknessthereof is about 10 nm.

In FIG. 8A, the Ta film 26 and the Ti film 25 at the bottom of the viahole 24 are etched mainly by the Ta ions 26 a and therefore, thethickness of the Ta film 26 at the bottom of the via hole 24 is thinnerthan that of the Ta film 26 at the bottom of the trench groove 23.

In FIG. 8B, on the other hand, the Ta film 26 similarly remains at thebottom of the via hole 24, but the bottom of the via hole 24 is moreetched than when the Ti film 25 is 13 nm thick and the thickness of theTa film 26 at the bottom of the via hole 24 is thinner than that of theTa film 26 at the bottom of the trench groove 23.

The Ta film 26 is also formed at the bottom of the wiring groove 23.

FIG. 9A is a phase diagram of Cu and Ti. FIG. 9A shows that Ti and Cuare likely to react. FIG. 9B is a phase diagram of Cu and Ta. FIG. 9Bshows that Ta and Cu are unlikely to react.

Thus, if, for example, the seed Cu film 28 is formed so as to be incontact with the Ti film 25, the Ti element and the Cu element willreact. When the Ti element and the Cu element react, the resistance ofthe Cu layer 29 increases. However, since the Ta film 26 is formed overthe Ti film 25 in the present embodiment, diffusion of the Ti elementinto the Cu layer 29 is suppressed.

FIG. 10 is a graph showing the thickness of seed Cu with respect to theaspect ratio of a via hole.

The horizontal axis shows the aspect ratio of the via hole and thevertical axis shows the thickness of a seed Cu film formed at thesidewall of the via hole.

When the aspect ratio of the via hole is 1.5 or less, the thickness ofthe Cu film was the same in the device A and the device C. If, on theother hand, the aspect ratio of the via hole is 2.5, the thickness ofthe Cu film was formed thicker in the device C than in the device A. Ifcoverage of the Cu film is poor, voids are generated in the via hole,leading to lower wiring reliability.

Analysis of a via hole section by energy dispersive X-ray (EDX) will bedescribed.

FIGS. 11A and 11B show views of samples of EDX analysis Formation of theseed Cu film 28 and the Cu layer 29 is omitted in FIGS. 11A and 11B.

As shown in FIG. 11A, an opening of a via hole formed in a semiconductordevice is generally circular. If, however, focused ion beam (FIB)processing for EDX analysis is performed, interference with observationresults is caused by a curvature part of the opening of the via hole.Thus, as shown in FIG. 11B, the shape of the opening was changed to aquadrangular shape here for EDX observation after performing FIBprocessing. A groove of 70 nm in width was formed in the interlayerdielectric film 22 a, 20 nm of the Ti film 25 was formed, and the Tafilm 26 was formed over the Ti film 25. The long-throw sputteringprocess was used for the formation of the Ta film 26 under theconditions of the target power supply of 1 kW to 18 kW, the substratebias of 0 W, Vd of 1 nm/sec, and Ve of 0 nm/sec so that the thickness ofthe Ta film 26 became about 3 nm. Then, the Ta film 26 and the Ti film25 formed at the bottom are etched. Conditions therefor were the targetpower supply of 1 kW to 5 kW, the substrate bias power of 200 W to 400W, Vd of the Ta film of 0.7 nm/sec, Ve of 0.9 nm/sec, and the formationtime of 40 sec.

FIGS. 12A and 12B show observation photographs by STEM of a via holesection on which FIB processing is performed.

FIG. 12B is an enlargement of a bottom of FIG. 12A. The bottom of a viahole is etched to a V shape.

FIGS. 13A, 13B and 13C show EDV analysis results in the presentembodiment. EDX analysis was performed for the Ti and Ta elements.

FIG. 13A is an enlargement of FIG. 12B. Graphs of the EDV analysisresults detailing components of each film are shown. In FIGS. 13B and13C, the horizontal axis shows the distance from an SOG film for FIBprocessing protection formed inside the via hole and the vertical axisshows the number counted by a detector of an analyzer, which is a valueproportional to the number of target elements. FIG. 13C shows an area oflow counts in FIG. 13B.

FIG. 13B shows that a Ti film and a Ta film are laminated over adielectric film and the Ti—Ta film 27 is present over the Ta film.

In the embodiments, in addition to the Ti element, for example, Zr orMn, or an alloy of two elements from Ti, Zr, and Mn that have goodreactivity with Cu may be used for the Ti film. In addition to the Tafilm, for example, W or an alloy of Ta and W having properties ofpreventing Cu diffusion may be used. Moreover, a similar effect can beobtained from combinations of materials that can constitute the presentembodiment.

1. A method of manufacturing a semiconductor device, comprising: forminga first wiring layer over a semiconductor substrate; forming adielectric film over the first wiring layer; forming, in the dielectricfilm, a first opening and a second opening within the first openingwhich reaches the first wiring layer; forming a first metal filmcontaining a first metal over a surface of the first opening, the secondopening, and the dielectric film; etching the first metal film at abottom of the second opening using a sputtering process and forming asecond metal film containing a second metal over the surface of thefirst opening, the second opening, and the dielectric film; burying aconductive material in the second opening and the first opening; and insaid forming the second metal film, a first Vd/Ve at the bottom of thesecond opening is smaller than a second Vd/Ve at the surface of thedielectric film, where Vd is a deposition rate and Ve is an etchingrate.
 2. The method according to claim 1, further comprising: afterforming the first metal film, a third metal film containing the secondmetal is formed over the surface of the first opening, the secondopening, and the dielectric film before forming the second metal film.3. The method according to claim 1, wherein in forming the second metalfilm, a fourth metal film containing the first metal and the secondmetal is formed over a sidewall of the second opening.
 4. The methodaccording to claim 1, wherein any one of argon, helium, and xenon isused as a sputtering gas for formation of the second metal film.
 5. Themethod according to claim 1, wherein the first metal includes any one oftitanium, zirconium, and manganese, or alloys thereof.
 6. The methodaccording to claim 1, wherein the second metal includes any one oftantalum and tungsten, or alloys thereof.
 7. The method according toclaim 1, wherein the conductive material includes copper.
 8. The methodaccording to claim 7, wherein burying the conductive materialcomprising: forming a seed copper film over the surface of the firstopening, the second opening, and the dielectric film; and depositing acopper wiring film over the seed copper film using an electroplatingmethod.
 9. The method according to claim 8, wherein the seed copper filmis formed by a sputtering process.
 10. The method according to claim 1further comprising: after forming the second metal film, a fifth metalfilm containing the second metal is formed over the surface of the firstopening, the second opening, and the dielectric film by a sputteringprocess before burying conductive material.